High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes

Product Details
Customization: Available
Color: Customized
Material: Silicone
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  • High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
  • High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
  • High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
  • High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
  • High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
  • High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
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  • Overview
  • Product Description
  • Specification
  • Company Profile
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
TSP
Maximum Voltage
<10KV
Thermal Rating
94 V0
Thermal Conductivity
5.0 W/M-K
0.32 ºCin²/W
Volume Impedance
1.5*10^16 Ω.Cm
Thickness
0.5-5.0mm
Density
2.6-2.8 G/Cm^3
Hardness
25-40 ºC Shore C
Application Temperature
-50 - 200 ºC
Breakdown Voltage
> 7 Kv/mm
Transport Package
Customized
Specification
Customized
Trademark
TOUSEN
Origin
China

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

Product Description
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad
Our non-silicone thermal pad is engineered for efficient heat dissipation in a variety of electronic devices. Designed to meet the high demands of modern electronics, this thermal pad ensures optimal thermal management while maintaining reliability and durability.
Specification
Item
Data
Test Method
Thermal Conductivity
5.0 w/m-k
ASTM D5470
0.32 ℃in²/W
ASTM D5470
Volume Impedance
1.5*1016 Ω.cm
ASTM D527
Thickness
0.5-5.0mm
ASTM D374
Density
2.6-2.8 g/cm3
ASTM D792
Hardness
25-40 ℃ Shore C
ASTM D2240
Application Temperature
-50 - 200 ℃
ASTM G166
Breakdown Voltage
> 7 KV/mm
ASTM D149
Dieletric Constant
7/1
ASTM D150
weight Dammnify
< 2%
ASTM E595
Elongation
60%
ASTM D412
Siloxane Volatile s d4-d20
< 1%
GC-FID
UL Flammability Rating
V-0/UL94
UL-94
Feature
Non-Silicone Composition: Ideal for applications where silicone sensitivity is a concern.
Customizable Thickness: Available in thicknesses ranging from 0.5mm to 5.0mm to suit various needs.
Wide Operating Temperature Range: Performs effectively from -40°C to 150°C.
Soft and Flexible: Easily conforms to uneven surfaces, reducing thermal resistance.
High Electrical Insulation: Provides excellent dielectric strength, ensuring safe operation.
Low Outgassing: Minimizes the risk of contamination in sensitive electronic environments.
Applications
Computers and Laptops: Enhances cooling for CPUs and GPUs.
LED Lighting: Improves thermal management in LED assemblies.
Consumer Electronics: Manages heat in smartphones, tablets, and other portable devices.
Power Electronics: Ensures efficient cooling in power supplies and inverters.
Automotive Electronics: Suitable for managing heat in electronic control units and other vehicle components.
Company Profile
Guangdong Dongsen Zhichuang Technology Co., Ltd.was established in 2019, located in Guangdong Province, China, with a registered capital of 5 million RMB. We operate two R&D Center in China and Japan, along with two production bases in Guangdong Province, China. With over 200 employees boasting 14 years of industry experience in research, development, and production, we specialize in manufacturing and selling thermal conductive materials such as thermal conductive silicone pads, thermal grease, thermal double-sided adhesive tape, thermal potting compound, thermal gel, thermal copper foil, copper foil tape, graphite sheets, and thermal ceramic sheets. Additionally, we offer customized die-cutting services for various products. We have been providing OEM customization services for major global thermal material brands for an extended period. Our clientele includes major players in industries such as new energy vehicles, computers, power supplies, LED lighting, 3C electronics, network communications, electro mechanical equipment, instrumentation, and consumer electronics.
Our factory is certified under ISO9001, ISO14001, and IATF16949 systems, and our products hold authoritative certifications from third-party testing institutions like UL and SGS, ensuring compliance with requirements such as REACH\ROHS. We are globally recognized as a leading provider of thermal management solutions.
We are committed to meeting customer needs by delivering high-quality products and providing fast and flexible services to maximize customer value. Through our dedication, we have established strong partnerships with major new energy vehicle manufacturers, telecommunications companies, leading smartphone brands, and professional equipment manufacturers worldwide, enabling us to serve customers globally.
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes
Packaging & Shipping
High-Performance Non-Silicone Thermal Pad for Efficient Heat Dissipation in Electronics Various Sizes

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