High Thermal Conductivity Phase Change Metal Thermal Conductive Sheet for CPU & Power Electronics

• Customization: Available
• Application: CPU Servers
• Color: Bright Silver
• Model NO.: TSPCM
• Maximum Voltage: <10KV
• Thermal Conductivity (W/M·K): ≥60W
• Thermal Resistance: 0.06
• Thickness (mm): 0.05-0.2
• Specific Heat (J/G·K): 0.31
• Density (G/Cm³): 7.7
• Volume Resistivity (Ω·cm): 9.7X10^-6
• Phase Change Temperature (°c): 60
• Volatility (%): <0.001
• Specification: ≥ 60W
• Trademark: TOUSEN
• Origin: China

Product Description

Product Description

The Phase Change Metal Thermal Pads are advanced thermal interface materials designed for superior thermal management. These pads undergo a phase change at low melting points, filling the gaps between heat sources and heatsinks through capillary action, effectively reducing thermal resistance and enhancing heat transfer.

Feature

* Exceptional Thermal Conductivity: With a thermal conductivity of up to ≥70W/m·K, these pads provide outstanding performance for heat dissipation.
* Stable Physical and Chemical Properties: Non-toxic, harmless, and free from volatile substances such as silicone oil, ensuring safe usage.
* Ideal for High-Temperature Applications: Suitable for long-term use in high-temperature and high-heat flux environments.
* Low Thermal Resistance Post-Phase Change: Offers a significant reduction in thermal resistance, outperforming existing thermal interface materials.
* Environmentally Friendly: Complies with ROHS 2.0 standards, ensuring safe and eco-friendly usage.

Physical Properties

Parameter	Test Result		Reference Standard
Color	Bright Silver	Bright Silver	Visual
Thermal Conductivity (W/m·K)	≥60W	≥70W	Laser Flash Method
Thermal Resistance (°C·cm²/W)	0.06	0.03	ASTM D5470
Thickness (mm)	0.05-0.2	0 .1~0.25	Customizable
Specific Heat (J/g·K)	0.31	0 .238	ASTM E1269-2011
Density (g/cm³)	7.7	7 .23	ASTMD792
Volume Resistivity (Ω·cm)	9.7×10^-6	9.7X10^-6	ASTMD257
Phase Change Temperature (°C)	60	45~120	-
Volatility (%)	<0.001	<0.001	-
Environmental Performance	ROHS 2.0	ROHS 2.0	-

Company Intriduction

Guangdong Dongsen Zhichuang Technology Co., Ltd.was established in 2019, located in Guangdong Province, China, with a registered capital of 5 million RMB. We operate two R&D Center in China and Japan, along with two production bases in Guangdong Province, China. With over 200 employees boasting 14 years of industry experience in research, development, and production, we specialize in manufacturing and selling thermal conductive materials such as thermal conductive silicone pads, thermal grease, thermal double-sided adhesive tape, thermal potting compound, thermal gel, thermal copper foil, copper foil tape, graphite sheets, and thermal ceramic sheets. Additionally, we offer customized die-cutting services for various products. We have been providing OEM customization services for major global thermal material brands for an extended period.
Our clientele includes major players in industries such as new energy vehicles, computers, power supplies, LED lighting, 3C electronics, network communications, electro mechanical equipment, instrumentation, and consumer electronics. Our factory is certified under ISO9001, ISO14001, and IATF16949 systems, and our products hold authoritative certifications from third-party testing institutions like UL and SGS, ensuring compliance with requirements such as REACH\ROHS. We are globally recognized as a leading provider of thermal management solutions.
We are committed to meeting customer needs by delivering high-quality products and providing fast and flexible services to maximize customer value. Through our dedication, we have established strong partnerships with major new energy vehicle manufacturers, telecommunications companies, leading smartphone brands, and professional equipment manufacturers worldwide, enabling us to serve customers globally.