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High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad

GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
  • Audited Supplier
  • 5 yrs

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Product Highlights

  • Multiple Thickness Options: Available in 0.3mm, 0.5mm, 1mm, 1.5mm, and 2mm for various needs.
  • Custom Size Support: Dimensions like 40*60mm and 40*134mm with custom sizes available.
  • RoHS 2.0 Compliant: Environmentally friendly, non-corrosive, and meets global safety standards.
  • OEM & Customization: Full OEM services and customized die-cutting for specific requirements.
  • Multi-Industry Application: Ideal for mobile devices, automotive, servers, and communication equipment.

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Product Images of High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad

High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad pictures & photos
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad pictures & photos
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad pictures & photos
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad pictures & photos
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad pictures & photos
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad pictures & photos
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
  • High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
  • High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
    High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
  • High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
    High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
  • High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
    High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
  • High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
    High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
  • High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
    High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
  • High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
    High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad

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Product Description

Product Description
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
Graphen Thermal Pad
Efficient Heat Dissipation: Graphene-silicone composite material ensures high thermal conductivity for efficient heat dissipation.
Multiple Thickness Options: Available in 0.3mm, 0.5mm, 1mm, 1.5mm, and 2mm thicknesses to meet various cooling requirements.Wide Application: Suitable for mobile devices, TVs, PCs, communication equipment, servers, automotive applications, and other high-heat LSI cooling scenarios.
Temperature Resistant: Operates reliably from -50°C to 150°C.
Applications:
Mobile Devices: Smartphones, tablets, etc.TVs, PCs: LCD TVs, laptops, etc.
Communication Equipment: Wireless base stations, wired communication devices
Servers: Data centers and large-scale computer systems
Automotive: Automotive electronics, engine control units, etc.
Specifications
Composition: Graphite, SiliconeAppearance: Gray flake form
Thickness Options: 0.3mm, 0.5mm, 1mm, 1.5mm, 2mm
Dimensions: 40*60mm, 40*134mm (custom sizes available)
Thermal Conductivity: ≥20W/m·K, ≥25W/m·K, ≥30W/m·K (varies with thickness)Compression Rate: ≥15% to ≥30% (at 30PSI pressure)
Volume Resistivity: 8~30Ω·cm
Environmental Performance: ROHS 2.0 compliant, non-corrosive
Specification
Feature
Test Result
Reference Standard
Product Feature
Silicone Composite
-
Composition
Graphite, Silicone
-
Appearance
Gray Flake Form
Visual Inspection
Thickness (mm)
0.3
0.5
1
1.5
2
ASTM D374
Product Dimensions (mm)
40*60
40*134
40*134
40*134
40*134
-
Thermal Conductivity (W/m·K)
≥20W
≥20W
≥25W
≥25W
≥30W
ASTM D5470
Compression Rate (%)
≥15
≥20
≥30
≥30
≥30
30PSI
Volume Resistivity (Ω·cm)
8~30
ASTM D257
Operating Temperature Range (°C)
-50~150
-
Corrosion Resistance
None
-
Environmental Performance
ROHS 2.0
-
Flammability Rating
V-0
UL-94
Company Profile
Guangdong Dongsen Zhichuang Technology Co., Ltd.was established in 2019, located in Guangdong Province, China, with a registered capital of 5 million RMB. We operate two R&D Center in China and Japan, along with two production bases in Guangdong Province, China. With over 200 employees boasting 14 years of industry experience in research, development, and production, we specialize in manufacturing and selling thermal conductive materials such as thermal conductive silicone pads, thermal grease, thermal double-sided adhesive tape, thermal potting compound, thermal gel, thermal copper foil, copper foil tape, graphite sheets, and thermal ceramic sheets. Additionally, we offer customized die-cutting services for various products. We have been providing OEM customization services for major global thermal material brands for an extended period. Our clientele includes major players in industries such as new energy vehicles, computers, power supplies, LED lighting, 3C electronics, network communications, electro mechanical equipment, instrumentation, and consumer electronics.
Our factory is certified under ISO9001, ISO14001, and IATF16949 systems, and our products hold authoritative certifications from third-party testing institutions like UL and SGS, ensuring compliance with requirements such as REACH\ROHS. We are globally recognized as a leading provider of thermal management solutions.
We are committed to meeting customer needs by delivering high-quality products and providing fast and flexible services to maximize customer value. Through our dedication, we have established strong partnerships with major new energy vehicle manufacturers, telecommunications companies, leading smartphone brands, and professional equipment manufacturers worldwide, enabling us to serve customers globally.
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
High Thermal Conductivity Low Thermal Resistance Flexible Advanced Graphene Thermal Pad
FAQ
Q: What is the MOQ?
A: Standard MOQ is 200 pcs, but we support trial orders for new partners. 
 
Q: Can I request custom services?
A: Yes! We offer various customized services. 
 
Q: What's the lead time?
A:  7–10 days.  
 
Q: Can I buy samples placing orders?
A: Yes.Please feel free to contact us.
 
Q: Do you support OEM branding?
A: Yes – private labeling and OEM services available.

About the Supplier

This supplier has been audited by TÜV Rheinland. Verify the report on the official TÜV Rheinland website with ID "MIC-ASR252490". Items marked "verified" are certified.

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GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.

About Our Factory & Business Background

Address
No 5 Lucheng Westroad Qingxi Town, Dongguan, Guangdong, China
Terms of Payment
LC, T/T, D/P, PayPal, Western Union, Money Gram
International Commercial Terms(Incoterms)
CIF, DDP, CIP, Others
Average Lead Time
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Nearest Port
SHENZHEN

Our Production Capability & Technical Expertise

Main Products
Thermal Pad, Thermal Silicone Pad, Thermal Paste, Thermal Grease, Silicone Foam, Solid Silicone, Copper Foil, Battery Copper, Thermal Tape, Polyimide Tape

Our Industry Experience & Global Business Record

Export Year
2009-01-01
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

FAQ

What is the MOQ?
Standard MOQ is 200 pcs, but we support trial orders for new partners.
Can I request custom services?
Yes! We offer various customized services.
Can I buy samples placing orders?
Yes.Please feel free to contact us.

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