Thermal Pad Server Tsp020 Filler Silicone Cooling Pad for Chip and Chip Component

• Customization: Available
• Thermal Conductivity: 1.0-8.0W/M-K
• Thickness: 0.3-14.0mm
• Density: 1.8-5g/Cc
• Hardness: 10-70 Shore C
• Continuous Use Temp: -40 to 300
• Breakdown Voltage: 5000-7000VAC/mm
• UL Flammability Rating: 94 V0
• Transport Package: Custom
• Specification: 200*400/330*300/custom
• Trademark: TOUSEN
• Origin: China
• HS Code: 35069900
• Production Capacity: 500000

Product Description

Company Profile

Thermal pad server TSP020 filler silicone cooling pad for chip and chip component

    Guangdong Dongsen Zhichuang Technology Co., Ltd. was established in 2009 with a total registered capital of 11 million Chinese Yuan and more than 200 employees. We have two independent manufactuers located in Huizhou and Jiangxi separately . we also have oversea offices in HK and Japan to provide high-quality services to all our valued customers.
      Our company has passed ISO 9001, ISO1400, IATF16949, OHSAS18001 and other related management system certifications, and our products have got UL\CE\ROHS\REACH and other certifications.
      As a professional manufacturer in the field of thermal interface materials and EMI electromagnetic interference materials, Dongsen mainly provides silicone thermal conductive pads, thermal grease, thermal graphite sheet , thermal conductive tape rolls ,metal foil tapes (copper foil tape, aluminum foil tape), high temperature polyimide tapes, also we provide die cutting customize service as per customers' drawings. We are one of the biggest and most comprehensive solution suppliers of thermal conductivity materials, insulating materials and shielding materials in China.
      Dongsen focuses on meeting customer needs and strives to maximize the profits of customers. We gain trust of various well-known customers, and has long-term cooperation with Samsung, Huawei, ZTE, Changhong, Panasonic, Foxconn, Midea, etc., and has been well received!

Our Partners

Our Advantages

Detailed Photos

Tousen thermal interface materials transfer heat from electronic components to heat sinks and are used to eliminate air gaps from the interface. Our materials deliver lower thermal impedance, higher thermal conductivity and greater compliance and conformability.They are also highly reliable, with greater adhesion properties that will enhance your application's handling ease and performance, guaranteeing a longer service life. Our thermal interface materials have been designed into thousands of applications, ensuring high performance and integrity.

 

About thermal silicon pad :

Thermal conductive silicone gap filler pad: It is specially designed for the purpose of heat transfer between heat source and heat sink.

Standard size: 400mm*200mm, support to cut any shapes and any sizes according to customer demands.

Basic thickness : 0.3~14mm, special thickness can be customized.

Viscousity : The product itself is slightly viscous, if need to strengthen adhesion , we support to back adhesion glue per customer's requirement.

Color:   Normally we use grey color for production . If need special other color, please tell us when order placed . Thanks

We have 20 die-cutting production lines, which can die-cut according to customer drawings and provide integrated services(thermal conductive silicone pad die cuting)

 

Typical APPLICATIONS

silicone thermal pad are widely used in modern electronics,communications,medical and automotive industries
* High thermal conductivity module
* new energy vehicles
* Microprocessors, memory chips and graphics processors
* Network communication equipment
* Car equipment, charger
* High-speed hard disk drive
* 5G/6G communication module
* Power Battery
* High power LED lights

Product Parameters

There are many types of thermal pad, and various parameters can be customized according to customer requirements. Thermal conductivity, thickness, hardness, size, etc. can be processed according to customer requirements, and die-cutting services are provided to meet the packaging needs of various automated production.

The following provides the specifications of the thermal conductivity 8W series products for reference
silicone thermal pad TSP080
 

Model#	Unit	TSP100	TSP300	TSP400	TSP030	TSP500	TSP500G
Thickness	mm	0.15~10	0.15~10	0.15~10	0.3~10	0.3~10	0.5~5
Density	g/cc	2.1	2.3	2.7	2.9	3	3.1
Thermal Conductivity	W/m.k	1.5	2	2.5	3	3.5	4
Standard Hardness	Shore 00	40/60	40/60	40/60	40/60	40/60	40/60
Customized Hardness	Shore 00	10~90	10~90	10~90	20~90	20~90	30~90
Elongation Rate	/	50%	50%	40%	40%	30%	30%
Tensile Strength	psi	40	40	30	30	30	30
Flame Rating	UL 94	V-0	V-0	V-0	V-0	V-0	V-0
Working Temp.	ºC	-50~200	-50~200	-50~200	-50~200	-50~200	-50~200
Dielectric strength	kV/mm	>8	>8	>8	>8	>8	>8
Thermal Resistance	ºC*in^2/W @30psi,1mm	0.9	0.7	0.5	0.45	0.45	0.4
Model#	Unit	TSP600D	TSP600G	TSP700	TSP800	TSP1000	TSP1200
Thickness	mm	0.5~10	0.5~5	0.5~5	0.5~5	0.5~5	0.8~5
Density	g/cc	3.2	3.3	3.4	3.4	3.4	3.4
Thermal Conductivity	W/m.k	5	6	7	8	10	12
Standard Hardness	Shore 00	40/60	40/60	40/60	40/60	40/60	40/60
Customized Hardness	Shore 00	30~90	30~90	30~90	30~90	30~80	30~80
Elongation Rate	/	30%	30%	20%	15%	15%	15%
Tensile Strength	psi	30	30	20	20	10	10
Flame Rating	UL 94	V-0	V-0	V-0	V-0	V-0	V-0
Working Temp.	ºC	-50~200	-50~200	-50~150	-50~150	-50~125	-50~125
Dielectric strength	kV/mm	>8	>8	>6	>6	>6	>6
Thermal Resistance	ºC*in^2/W @30psi,1mm	0.31	0.25	0.18	0.15	0.12	0.1