Low Thermally Resistance Interface Material for CPU Motor Vehicle

Product Details
Customization: Available
Application: Building Material, Electrical Power System, Electronic Communication, Electronic Device, Industrial Equipment, Laboratory Equipment, Medical Equipment, Transportation
Color: Grey
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Registered Capital
5000000 RMB
Plant Area
>2000 square meters
  • Low Thermally Resistance Interface Material for CPU Motor Vehicle
  • Low Thermally Resistance Interface Material for CPU Motor Vehicle
  • Low Thermally Resistance Interface Material for CPU Motor Vehicle
  • Low Thermally Resistance Interface Material for CPU Motor Vehicle
  • Low Thermally Resistance Interface Material for CPU Motor Vehicle
  • Low Thermally Resistance Interface Material for CPU Motor Vehicle
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  • Overview
  • Product Description
  • Product Parameters
  • Detailed Photos
  • Certifications
  • Packaging & Shipping
  • Company Profile
  • Our Advantages
Overview

Basic Info.

Model NO.
TSPAD
Material
Silicone
Maximum Voltage
<10KV
Thermal Rating
-50~200 Degrees
Thickness
0.5~10mm Customized
Product Name
Thermal Insulation Gap Filler
Standard Size
200*400mm
Density
2.1~3.4G/Cm^3
Standard Hardness
40/60 Shore C
Customized Hardness
10~90 Shore C
Elongation
15~50%
Working Temperature
-50~200 Degress
Thermal Resistance
0.1~0.9
Transport Package
Carton Packaging
Specification
customized
Trademark
Tousen
Origin
China
Production Capacity
5000000000

Product Description

Product Description

 

Low Thermally Resistance Interface Material for CPU Motor Vehicle
Thermal conductive silicone pad is specially designed for the purpose of high performance thermal conductivity.

Pad standard size 400mm*200mm according to customer needs to cut the shapes.

Basic thickness 0.3mm/0.5mm/1mm/1.5mm/2mm/3mm, special size and thickness can be customized.

The product itself is slightly viscous, if need to strengthen the adhesive can be according to customer's requirement.

Grey color is for mass production products color , if need special color can be adjusted to the actual situation
 

Product Parameters

Some model's parameters are for customers reference. If you want to know more models,Please feel free to contact us with more information . Thanks !
 

Model# Unit TSP100 TSP300 TSP400 TSP030  TSP500 TSP500G
Thickness mm 0.15~10 0.15~10 0.15~10 0.3~10 0.3~10 0.5~5
Density g/cc 2.1 2.3 2.7 2.9 3 3.1
Thermal Conductivity W/m.k 1.5 2 2.5 3 3.5 4
Standard Hardness Shore 00 40/60 40/60 40/60 40/60 40/60 40/60
Customized Hardness Shore 00 10~90 10~90 10~90 20~90 20~90 30~90
Elongation Rate / 50% 50% 40% 40% 30% 30%
Tensile Strength psi 40 40 30 30 30 30
Flame Rating UL 94 V-0 V-0 V-0 V-0 V-0 V-0
Working Temp. ºC -50~200 -50~200 -50~200 -50~200 -50~200 -50~200
Dielectric strength kV/mm >8 >8 >8 >8 >8 >8
Thermal Resistance ºC*in^2/W @30psi,1mm 0.9 0.7 0.5 0.45 0.45 0.4
               
Model# Unit TSP600D TSP600G TSP700 TSP800 TSP1000 TSP1200
Thickness mm 0.5~10 0.5~5 0.5~5 0.5~5 0.5~5 0.8~5
Density g/cc 3.2 3.3 3.4 3.4 3.4 3.4
Thermal Conductivity W/m.k 5 6 7 8 10 12
Standard Hardness Shore 00 40/60 40/60 40/60 40/60 40/60 40/60
Customized Hardness Shore 00 30~90 30~90 30~90 30~90 30~80 30~80
Elongation Rate / 30% 30% 20% 15% 15% 15%
Tensile Strength psi 30 30 20 20 10 10
Flame Rating UL 94 V-0 V-0 V-0 V-0 V-0 V-0
Working Temp. ºC -50~200 -50~200 -50~150 -50~150 -50~125 -50~125
Dielectric strength kV/mm >8 >8 >6 >6 >6 >6
Thermal Resistance ºC*in^2/W @30psi,1mm 0.31 0.25 0.18 0.15 0.12 0.1

Detailed Photos

Low Thermally Resistance Interface Material for CPU Motor VehicleLow Thermally Resistance Interface Material for CPU Motor Vehicle

Low Thermally Resistance Interface Material for CPU Motor VehicleLow Thermally Resistance Interface Material for CPU Motor VehicleLow Thermally Resistance Interface Material for CPU Motor VehicleLow Thermally Resistance Interface Material for CPU Motor Vehicle

Certifications

Low Thermally Resistance Interface Material for CPU Motor Vehicle

Packaging & Shipping

Low Thermally Resistance Interface Material for CPU Motor Vehicle

Company Profile

Low Thermally Resistance Interface Material for CPU Motor Vehicle

Low Thermally Resistance Interface Material for CPU Motor VehicleLow Thermally Resistance Interface Material for CPU Motor VehicleLow Thermally Resistance Interface Material for CPU Motor VehicleLow Thermally Resistance Interface Material for CPU Motor VehicleLow Thermally Resistance Interface Material for CPU Motor Vehicle

Our Advantages

Low Thermally Resistance Interface Material for CPU Motor VehicleLow Thermally Resistance Interface Material for CPU Motor Vehicle

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