| Customization: | Available |
|---|---|
| Thermal Conductivity: | 1.0-8.0W/M-K |
| Thickness: | 0.25~5mm |
|
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Tousen thermal interface materials transfer heat from electronic components to heat sinks and are used to eliminate air gaps from the interface. Our materials deliver lower thermal impedance, higher thermal conductivity and greater compliance and conformability.They are also highly reliable, with greater adhesion properties that will enhance your application's handling ease and performance, guaranteeing a longer service life. Our thermal interface materials have been designed into thousands of applications, ensuring high performance and integrity.
Non - silicone Thermal Pad
Tousen AF series of non - silicone thermal pads are based on special resins. They have no low - molecular - weight siloxane volatilization or silicone oil bleeding, effectively avoiding the risks of mirror fogging and circuit failures caused thereby. They have excellent tensile strength and wear - resistant properties. They are applicable to sensors, AI data centers, security cameras, and medical equipment. The thermal conductivity can reach up to 8.0 W/m·K.
Silicone thermal conductive sheets can be individually packaged,
It can also be made coiled material, which is conducive to automated production.
Can authorize the sale of TOUSEN brand thermal conductive silicone pad,
Can also be processed on behalf of customer brands
We have 20 die-cutting production lines, which can die-cut according to customer drawings and provide integrated services(thermal conductive silicone pad die cuting)
silicone thermal pad are widely used in modern electronics,communications,medical and automotive industries
* High thermal conductivity module
* new energy vehicles
* Microprocessors, memory chips and graphics processors
* Network communication equipment
* Car equipment, charger
* High-speed hard disk drive
* 5G/6G communication module
* Power Battery
* High power LED lights
There are many types of thermal pad, and various parameters can be customized according to customer requirements. Thermal conductivity, thickness, hardness, size, etc. can be processed according to customer requirements, and die-cutting services are provided to meet the packaging needs of various automated production.
| Model# | Unit | TSAF100 | TSAF150 | TSAF300 | TSAF500 | TSAF600 | TSAF600G | TSAF800 |
| Thickness | mm | 0.25~5.0 | 0.25~5.0 | 0.5~5.0 | 0.5~5.0 | 1.0~5 | 1.0~5 | 0.5~5.0 |
| Density | g/cm^3 | 1.9 | 1.9 | 2.3 | 2.9 | 3.1 | 3.1 | 3.4 |
| Thermal Conductivity | W/m.k | 1 | 1.5 | 2 | 3 | 5 | 6 | 8 |
| Standard Hardness | Shore 00 | 50/70 | 50/70 | 50/70 | 50/70 | 50/70 | 50/70 | 50/70 |
| Elongation Rate | / | 1 | 1 | 0.7 | 0.7 | 0.5 | 0.5 | 0.3 |
| Tensile Strength | psi | 75 | 75 | 55 | 55 | 30 | 30 | 30 |
| Dielectric Strength | V/mil@AC | >200 | >200 | >200 | >200 | >200 | >200 | >200 |
| Flame Rating | UL 94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
| Volume Resistance | ohm.cm | 10^13 | 10^13 | 10^13 | 10^13 | 10^13 | 10^13 | 10^13 |
| Working Temp. | ºC | -40~125 | -40~125 | -40~125 | -40~125 | -40~125 | -40~125 | -40~125 |
| Thermal Resistance | ºC*in^2/W @30psi,1mm | 1.1 | 1 | 0.8 | 0.6 | 0.25 | 0.25 | 0.1 |
| Presssure Rate | @30psi,1mm | 0.3 | 0.3 | 0.3 | 0.3 | 0.2 | 0.2 | 0.2 |
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