Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material

Product Details
Customization: Available
Thermal Conductivity: 1.0-8.0W/M-K
Thickness: 0.3-14.0mm
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  • Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
  • Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
  • Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
  • Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
  • Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
  • Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
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  • Overview
  • Company Profile
  • Our Partners
  • Our Advantages
  • Detailed Photos
  • Typical APPLICATIONS
  • Product Parameters
Overview

Basic Info.

Model NO.
TSP
Density
1.8-5g/Cc
Hardness
10-70 Shore C
Continuous Use Temp
-40 to 300
Breakdown Voltage
5000-7000VAC/mm
UL Flammability Rating
94 V0
Transport Package
Custom
Specification
200*400/330*300/custom
Trademark
TOUSEN
Origin
China
HS Code
35069900
Production Capacity
500000

Packaging & Delivery

Package Size
15.00cm * 15.00cm * 5.00cm
Package Gross Weight
0.500kg

Product Description

Company Profile

     High thermal conductive silicone pad is a high thermal conductivity material.The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material.The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.

Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
    Guangdong Dongsen Zhichuang Technology Co., Ltd. was established in 2009 with a total registered capital of 11 million Chinese Yuan and more than 200 employees. We have two independent manufactuers located in Huizhou and Jiangxi separately . we also have oversea offices in HK and Japan to provide high-quality services to all our valued customers.
      Our company has passed ISO 9001, ISO1400, IATF16949, OHSAS18001 and other related management system certifications, and our products have got UL\CE\ROHS\REACH and other certifications.
      As a professional manufacturer in the field of thermal interface materials and EMI electromagnetic interference materials, Dongsen mainly provides silicone thermal conductive pads, thermal grease, thermal graphite sheet , thermal conductive tape rolls ,metal foil tapes (copper foil tape, aluminum foil tape), high temperature polyimide tapes, also we provide die cutting customize service as per customers' drawings. We are one of the biggest and most comprehensive solution suppliers of thermal conductivity materials, insulating materials and shielding materials in China.
      Dongsen focuses on meeting customer needs and strives to maximize the profits of customers. We gain trust of various well-known customers, and has long-term cooperation with Samsung, Huawei, ZTE, Changhong, Panasonic, Foxconn, Midea, etc., and has been well received!
Our Partners

Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material

Our Advantages

Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
Thermal Silicone Pad Thermal Pads Thermal Interface Material Good Endurance Wholesale Customized with Long Life for GPU CPU Motherboard Heatsink Pad

Detailed Photos

Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler MaterialLow Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
TOUSEN Conductive silicone pad Features & Benefits:
* Cost-effective, high conductivity, low thermal resistance
* Soft and flexible, reducing the interface thermal resistance
* High electrical insulation to protect electronic devices
* Natural sticky, easy application, reworkable
* Meet ROHS and UL environmental requirements

Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
We have 20 die-cutting production lines, which can die-cut according to customer drawings and provide integrated services(thermal conductive silicone pad die cuting)
Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler MaterialLow Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material

Silicone thermal conductive sheets can be individually packaged,
It can also be made coiled material, which is conducive to automated production.
Can authorize the sale of TOUSEN brand thermal conductive silicone pad,
Can also be processed on behalf of customer brands
Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material
Typical APPLICATIONS

silicone thermal pad are widely used in modern electronics,communications,medical and automotive industries
* High thermal conductivity module
* new energy vehicles
* Microprocessors, memory chips and graphics processors
* Network communication equipment
* Car equipment, charger
* High-speed hard disk drive
* 5G/6G communication module
* Power Battery
* High power LED lights

Low Thermally Resistance Silicone Heat Dissipation Pad Soft Gap Filler Material

Product Parameters

There are many types of thermal pad, and various parameters can be customized according to customer requirements. Thermal conductivity, thickness, hardness, size, etc. can be processed according to customer requirements, and die-cutting services are provided to meet the packaging needs of various automated production.

The following provides the specifications of the thermal conductivity 8W series products for reference
silicone thermal pad:

Model# Unit TSP100 TSP300 TSP400 TSP030  TSP500 TSP500G
Thickness mm 0.15~10 0.15~10 0.15~10 0.3~10 0.3~10 0.5~5
Density g/cc 2.1 2.3 2.7 2.9 3 3.1
Thermal Conductivity W/m.k 1.5 2 2.5 3 3.5 4
Standard Hardness Shore 00 40/60 40/60 40/60 40/60 40/60 40/60
Customized Hardness Shore 00 10~90 10~90 10~90 20~90 20~90 30~90
Elongation Rate / 50% 50% 40% 40% 30% 30%
Tensile Strength psi 40 40 30 30 30 30
Flame Rating UL 94 V-0 V-0 V-0 V-0 V-0 V-0
Working Temp. ºC -50~200 -50~200 -50~200 -50~200 -50~200 -50~200
Dielectric strength kV/mm >8 >8 >8 >8 >8 >8
Thermal Resistance ºC*in^2/W @30psi,1mm 0.9 0.7 0.5 0.45 0.45 0.4
               
Model# Unit TSP600D TSP600G TSP700 TSP800 TSP1000 TSP1200
Thickness mm 0.5~10 0.5~5 0.5~5 0.5~5 0.5~5 0.8~5
Density g/cc 3.2 3.3 3.4 3.4 3.4 3.4
Thermal Conductivity W/m.k 5 6 7 8 10 12
Standard Hardness Shore 00 40/60 40/60 40/60 40/60 40/60 40/60
Customized Hardness Shore 00 30~90 30~90 30~90 30~90 30~80 30~80
Elongation Rate / 30% 30% 20% 15% 15% 15%
Tensile Strength psi 30 30 20 20 10 10
Flame Rating UL 94 V-0 V-0 V-0 V-0 V-0 V-0
Working Temp. ºC -50~200 -50~200 -50~150 -50~150 -50~125 -50~125
Dielectric strength kV/mm >8 >8 >6 >6 >6 >6
Thermal Resistance ºC*in^2/W @30psi,1mm 0.31 0.25 0.18 0.15 0.12 0.1

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